June 8, 2011 — Semikron developed a power semiconductor packaging technology, SKiN, which uses flexible foil and sintered interconnects instead of bonding wires, solders, or thermal paste. Current density is doubled — 3A/cm² compared with 1.5 A/cm² with standard wire bond technology — and load cycle capability increases 10x. Converter volume can be reduced by 35%.

The SKiN sintered foil replaces the wire bonding on the chips, and the underside of the chip is sintered to the DBC substrate. The sintered layers have a lower thermal resistance than solder interconnects, and connect the chip across its full surface, improving thermal management. A sinter layer replaces the thermal paste layer and the soldered base plate.

Semikron expects the technology to be used for vehicle and wind power semiconductors, including SiC and GaN devices. The packaging technology enables use in higher operating temperatures with improved reliability over traditional power devices, according to the company. When SKiN packaging is used, a 3MW wind power converter can be fit into a single switch cabinet; a 90kW converter for hybrid and electric vehicles can be 35% smaller than the smallest converter currently available. For converters in vehicles and wind power units, liquid-cooled systems are used.

Semikron is a power semiconductor manufacturer. Learn more at www.semikron.com.

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