SEMICON West keynotes cover research, chip design, packaging

June 28, 2011 — On Keynote Stage (Esplanade Hall), SEMICON West keynoters will share perspectives from the chip design, packaging & assembly, and research points of view. Tien Wu, ASE; Rama K. Shukla, Intel; and Luc Van den hove, imec, are the honored presenters for SEMICON West 2011.

Semicon West 2011 runs July 12-14 at the Moscone Center in San Francisco.

Tien Wu is chief operating officer at Advanced Semiconductor Engineering Inc. (ASE), a Taiwan-based semiconductor packaging subcontractor. Wu will speak on Tuesday, July 12 in the morning (keynote begins at 9am. Wu told Advanced Packaging several years ago at SEMICON West that "back-end is leading the industry," and that the boundary between the front- and back-end is much more determined by business than by technology. "Money, not processes, determines the difference between the front- and back-end." Read Wu’s past comments here.

Tuesday afternoon, (starting at 1:30pm), Rama K. Shukla will speak. Shukla is VP of the Intel Architecture Group.

Wednesday morning (10:00am start), Luc Van den hove, president and CEO of imec, will share the research organizations’ perspective on the microelectronics industry. Van den hove keynoted the SPIE Advanced Lithography symposium earlier in 2011, discussing materials challenges, silicon photonics, and the spread of semiconductors into new applications.

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