June 8, 2011 – PR Newswire — Tektronix Component Solutions purchased 5 Teradyne J750EX semiconductor test systems to screen a wider variety of complex ASICs, increase test capacity, and generate test programs faster.
Tektronix offers test and screening services for high-density and high-speed ASICs and FPGAs for military, commercial aerospace, and space customers. The company will also be able to use the Teradyne systems for memory testing complex digital ICs up to 384 pins. This could include full characterization of off-the-shelf parts at extended temperature ranges, which Tektronix expects to be of use to their "high-performance mil-aero" customers, said Tom Buzak, president, Tektronix Component Solutions, adding that the shorter new test development times should help reduce test costs.
Tektronix Component Solutions’ component screening service is used to test component quality and performance against the manufacturer’s specifications and/or customer’s application performance and reliability criteria. It includes:
- electrical (surge testing, parametric testing, functional testing, and device characterization);
- package integrity (highly accelerated stress testing [HAST], particle impact noise detection [PIND], salt fog, thermal shock and temp-cycle, and plastic encapsulated microcircuit [PEM] testing);
- assembly evaluation (destructive physical analysis [DPA], prohibited materials analysis [PMA], scanning electron microscopy [SEM]and X-Ray);
- and life-testing (Burn-in, operational life, dynamics, endurance and climatic test).
Tektronix Component Solutions is a microelectronics services provider offering a complete range of custom design, prototyping, manufacturing, and test services to equipment manufacturers. Tektronix Component Solutions can be found on the web at www.component-solutions.tektronix.com/.
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