June 15, 2011 — Singapore’s Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR) launched its eleventh Electronic Packaging Research Consortium (EPRC11) to address various technology challenges in advanced semiconductor packaging.
IME initiated the first EPRC in 1996. The resource and cost-sharing platform shares R&D among local enterprises and multi-national companies. This cycle of electronics packaging R&D will keep "smaller and smarter devices" in mind on 4 projects over 18 months.
The consortium will tackle:
- Multiple Chip Embedded Wafer Level Packaging (WLP): Confronting re-construction process challenges and developing validated numerical models;
- Through Silicon Via (TSV) Interposers: Exploring design, integration methods, package reliability testing, high aspect-ratio TSV and high density back-end-of-line (BEOL) wiring on multiple heterogeneous chips on a common package platform;
- Fine Pitch Flip Chip with Cu Pillar: Developing a low-stress copper pillar flip-chip technology on copper low-k chips;
- High Performance Materials for Advanced Packaging: Investigating high conductive packaging materials to develop new modelling methodologies and processes.
EPRC11 consists of 23 IDM, foundry, assembly & test, and equipment and materials companies:
- Atotech S.E.A. Pte Ltd,
- Advanpack Solutions Pte Ltd,
- ASM Technology Singapore Pte Ltd,
- Disco Hi-Tec (S) Pte Ltd,
- Dow Corning Corporation,
- EV Group (EVG),
- GLOBALFOUNDRIES Singapore Pte Ltd,
- Heraeus Materials Singapore Pte Ltd,
- Hitachi Chemical Co., Ltd,
- Hisilicon Technologies Co. Ltd,
- Ibiden Singapore Pte Ltd,
- Infineon Technologies Asia Pacific Pte Ltd,
- OM Group Inc,
- Nissan Chemical Industries, Ltd,
- NEPES Pte Ltd,
- NXP Semiconductors,
- Optitune Pte. Ltd,
- Rolls-Royce Singapore Pte Ltd,
- Shanghai Sinyang Semiconductor Materials Co. Ltd,
- Sekisui Chemical Co. Ltd,
- Silecs International Pte Ltd,
- Tokyo Ohka Kogyo Co. Ltd
- United Test and Assembly Center Ltd (UTAC)
- A*STAR Institute of High Performance Computing (IHPC).
The Institute of Microelectronics (IME) is a research institute of the Science and Engineering Research Council of the Agency for Science, Technology and Research (A*STAR) in Singapore. Its key research areas are in integrated circuits design, advanced packaging, bioelectronics and medical devices, MEMS, nanoelectronics, and photonics. For more information, visit IME at http://www.ime.a-star.edu.sg. A*STAR is the lead agency for fostering world-class scientific research and talent for a vibrant knowledge-based and innovation-driven Singapore.
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