AMEC reactive ion etch tool enables sub-28nm nodes

July 11, 2011 — Advanced Micro-Fabrication Equipment Inc. (AMEC) launched its Primo second-generation 300mm very-high-frequency advanced decoupled reactive ion etch (AD-RIE) tool for sub-28nm critical process requirements.

The wafer processing tool has an advanced RF system for process stability and repeatability; better tunability techniques to enable ultra-fine critical dimension (CD) uniformity, and enhanced chamber materials for higher yields and lower defects.  

According to Ben Lee, director of technology, U.S. and Europe, AMEC, the company has been able to gain traction beyond foundries: memory manufacturers are now running production using the tool, and IDMs are showing interest.

In this interview, Lee describes the tool


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