Avantor, SACHEM selective etch chemisty doubles as wafer cleaner

July 6, 2011 — Avantor Performance Materials will launch the first in its new J.T.Baker SLCT Series of selective etch surface treatment chemistries, SLCT 128 sigma etchant, at SEMICON West 2011.

J.T.Baker SLCT 128 sigma etchant simultaneously cleans and selectively etches the wafer substrate in poly-gate architectures, creating a cavity for strain engineered gate structures. No pre-implant operations are required to tailor the initial etching. Highly controlled etch is paired with post-etch residue removal and pre-cleaning. The resultant clear, well-defined faceted sigma shape for epitaxy suits advanced nodes, and users may cut out an additional rinse after the process. Plasma pre-etching can be eliminated or reduced in some operations.

The self-cleaning etch chemistry can be used in front end of line (FEOL) wafer fab on strained silicon channels where silicon germanium (SiGe) and silicon nitride (SiN) induce strain on the silicon lattice under the gate region; FinFET structures where the semiconductor material is vertical rather than horizontal; and other advanced wafer processes.

The etchant was created through a joint development agreement between Avantor and SACHEM Inc., which covers specialty surface preparation and removal chemistries for thin-film wafer stacks. Avantor applied photoresist/residue removal technologies, while SACHEM engineered bulk etchants and surface prep aspects. Under the agreements, the companies established a global applications team supported by Avantor’s advanced wafer processing equipment.

Combining the companies’ core strengths in selective etch products enables better semiconductor manufacturing, said John Bubel, director of marketing, electronic materials, at Avantor, adding that the partnership smartly boosts investment in research and development. Tom Mooney, president of SACHEM Asia, added that the partnership is targeting emerging sub-22nm nodes, cutting down on process materials consumption and steps.

Avantor and SACHEM are developing other selective etch and targeted layer removal solutions with leading semiconductor manufacturers in Asia and the Americas.

Avantor plans to expand the SLCT Series with additional selective etch products in the near future, targeting selectivity to metal oxides and integration stacks common in advanced memory chip manufacturing.

To learn more about SLCT 128 sigma etchant and other selective etch products in development, visit Avantor booth 1607 at SEMICON West, July 12-14 at the Moscone Center in San Francisco, CA.

Avantor Performance Materials (formerly Mallinckrodt Baker, Inc.) manufactures and markets high-performance chemistries and materials. Avantor makes products used in the manufacturing of semiconductors, photovoltaic cells and flat panel displays (FPD). For additional information, visit www.avantormaterials.com

SACHEM Inc. delivers highly pure, precise and innovative chemical solutions designed to solve the most demanding and challenging applications. Learn more at www.sacheminc.com

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