EV Group joins Ga. Tech’s 3D packaging center

July 6, 2011 – EV Group has joined Georgia Tech’s 3D Systems Packaging Research Center (PRC) as a "manufacturing infrastructure member." Specifically, EVG will contribute its know-how and technology in temporary bonding and debonding, chip-to-wafer bonding and lithography technology, and associated product and processes to the PRC’s Silicon and Glass Interposer Industry (SiGI) Consortium research program.

Launched earlier this spring, the SiGi Consortium is pursuing development of less expensive (up to 10

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