July 27, 2011 – PRNewswire — EV Group (EVG), wafer bonding and lithography equipment supplier, began a manufacturing capacity expansion at its Austrian headquarters. The company cites a 40% increase in order intake in fiscal year 2011 compared with fiscal 2010. As part of the expansion, EVG will recruit about 100 additional employees.

The new building is adjacent to EVG’s existing manufacturing facility, doubling the company’s production floor space. It should come on-line in 2011.

EVG will also invest in additional machining capacity and new manufacturing technologies and facility upgrades, such as new filter fan units for particle-free manufacturing areas. Full air conditioning, additional hydraulic ramps, and a large overhead crane will improve workers’ capabilities and comfort.

A new visitor area will be built, allowing customers to observe manufacturing. Test rooms will enable customer-specific process development and customization, including a smooth source inspection process even at busy times.

EVG will need about 100 manufacturing and technical service and support hires to staff the expanded area. More information about current job vacancies can be found in the "careers section" on EV Group’s website (see below).

EV Group (EVG) makes wafer processing equipment for semiconductor, MEMS and nanotechnology applications. More information is available at www.EVGroup.com.

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