July 12, 2011 – JCN Newswire — Tanaka Kikinzoku Kogyo KK will partner with SUSS MicroTec KK to develop pattern transfer and bonding technology using sub-micron gold particles. The companies hope to replace gold bumping, sputtering, and other technologies in MEMS, LED, and 3D IC packaging.
This joint development will encompass development of technology for transferring patterns of sub-micron gold particles to a silicon wafer at one time at the low temperature of 150C on a high-volume production basis. Using the transferred pattern of gold particles, which have an effect on absorbing wafer surface roughness, it is possible to achieve metal-metal bonding on a wafer level at 200C, enabling high temperature resistant hermetic seals and electrical connections.
The pattern transfer and bonding technology enables electrical connections and hermetic seals with the minimum necessary amount of gold material while also resolving issues faced when using current technologies: plating, screen printing, and sputtering, as well as micro-bump bonding technologies. The process aims to meet high heat conductivity, high heat resistance, narrow line width and narrow pitch goals for advanced devices.
Tanaka Kikinzoku Kogyo has developed manufacturing processes of a substrate for pattern transferring of sub-micron gold particles which offer higher heat resistance and lower stress than existing joints by soldering, and able to be bonded at low temperature due to its size effect. SUSS MicroTec will develop a wafer-level transfer and bonding equipment using such transfer substrates. This technology development is being carried out with the cooperation of Professor Shuichi Shoji and Associate Professor Jun Mizuno, Nanotechnology Research Laboratory, Waseda University.
Through the joint development, the two companies aim to begin sales of the transfer substrates and the transfer and bonding equipment in March 2012.
By implementing the bonding technology in packaging and assembly processes, manufacturers of micro electro mechanical systems (MEMS) devices, light emitting diodes (LEDs) chips and small-sized chip electronic components can form fine patterns on silicon wafers for sealing frames and electrodes at once without any waste and a 100% usage rate (the ratio of material that can be mounted on a product) of expensive gold material. The process can form hermetic seals in advanced MEMS, bump electrodes for high-brightness LEDs (HB-LED), and enable 3D packaging.
Tanaka Kikinzoku Kogyo and SUSS MicroTec will have a joint booth at Exhibition Micromachine/MEMS 2011 held at Tokyo Big Sight (Ariake, Koto-ku, Tokyo) July 13-15 at East Hall 2, booth B-05.
Tanaka Precious Metals has built a diversified range of business activities focused on the use of precious metals. Website: http://pro.tanaka.co.jp
SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. For more information, please visit http://www.suss.com.