Moritex upgrades MEMS inspection system

July 26, 2011 — Imaging and vision system maker Moritex Corporation upgraded its IRise Macro Micro IR Vision System infrared (IR) transmission inspection system for micro electromechanical systems (MEMS) and semiconductor devices, capable of capturing macro and micro images in a single-shot evaluation of up to 8" wafers.

The upgraded version of IRise has a 2.6x faster working speed than the prior model and enhanced software with an optional automated visual inspection feature that supports cassette-to-cassette (C to C) systems.

The inspection system can be used to detect defects on hermetic bonding interfaces, 3D package structures, low-k dielectric film growth, wafer-level chipscale packages (WLCSP) and system-in-package (SiP) defects, chipping detection after wafer dicing, Sacrificial oxide layer etching non-destructive measurement, power device substrate inspection, bare wafer evaluation tests, bonding shift measurement, and SOI active layer thickness measurement.

The system’s PC-controlled motorized zoom lens offers low magnification 33x ~ 198x and high magnification 330x ~ 1760x magnification on 27" wide monitor. Inspection area is 200mm2 with 100mm Z (height).

Moritex manufactures and engages in businesses related to applied optical equipment and functional materials. Listed on the first section of the Tokyo Stock Exchange. (Securities code: 7714) Learn more at (English translation).

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