Nordson ASYMTEK film-frame packaging workcell improves MEMS, wafer dicing

July 11, 2011 — Nordson ASYMTEK introduced the MH-910W + Spectrum S-920N dispenser automated workcell for film-frame wafer-level packaging applications, with same-side loader/unloader integrated with the Spectrum S-920N dispenser. It can be used to cap MEMS and image sensors, coat wafers for imaging devices such as digital light processing (DLP), jet thin coatings to improve laser dicing, and more.

The tool is designed for 150mm film-frame wafer processing, and supports various sizes. Integrating the dispensing and handling operation into a single workcell improves throughput and simplifies the packaging line, according to the company. Advanced process controls prevent errors during transport and dispense. Both the MH-910W film-frame loader/unloader and S-920N dispensing system are fully enclosed with interlocked doors and windows. For service, access panels are removable and the system includes built-in software maintenance tools.

Handling features include programmable transport speed, multiple sensors, soft-touch grippers, and active pinch wheels. Film-frame wafers are pulled from one cassette and returned to a second cassette after dispense. A frame sensor identifies the next available wafer. Sensors also ensure cassette slots are empty before returning processed wafers to the second cassette.

The workcell has a 1225 x 1321mm footprint and meets SEMI-S2, SEMI-S8, SMEMA, and CE standards and certifications.

The new workcell will be on display at the Nordson ASYMTEK booth #6071 at SEMICON West, July 12-14, Moscone Center, San Francisco, CA.

Nordson ASYMTEK provides automated fluid dispensing, conformal coating, and jetting technologies. For more information, visit

Nordson Corporation (Nasdaq: NDSN) makes precision dispensing equipment, systems for testing and inspection of electronic components, and UV curing and surface treatment tools. Visit Nordson on the web at

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