Plasma tool from Nordson MARCH handles 5 wafer sizes

July 7, 2011 – BUSINESS WIRE — Nordson MARCH’s FlexTRAK-WF low-cost, cassette-based automated plasma treatment system handles five wafer sizes with minimal hardware change-over. An integrated robot and aligner automate wafer and other flat substrate handling at up to 50 wafers per hour. Plasma uniformity suits ashing, etching, and descum for wafer level packaging and general wafer processing applications.

Two separate wafer load stations enable production continuity and minimal idle time. The universal cassette stage and multi-size aligner can take on 3"-8" wafers. Integrated wafer recognition technology detects and adjusts for potential wafer protrusion, double-stacking, cross-slotting, and other issues.

See Nordson MARCH demonstrate the FlexTRAK-WF in booth #6071 at SEMICON West, Moscone Center, San Francisco, CA, July 12-14, 2011.

Nordson MARCH makes plasma processing technology for the semiconductor, printed circuit board (PCB), microelectronics, and medical & life science device manufacturing industries. Visit the Nordson MARCH website for more details:

Nordson Corporation (Nasdaq: NDSN) produces precision dispensing equipment, testing and inspection systems for electronic components, and technology-based systems for UV curing and surface treatment processes. Visit Nordson on the web at

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