July 15, 2011 — SigmaTech’s UltraMap-TSV system won Best of West at SEMICON West, presented by industry association SEMI and Solid State Technology.
The UltraMap-TSV system from SigmaTech is the world’s first fully automated through silicon via (TSV) and deep-trench metrology system capable of characterizing both TSV and deep-trench features from both the front and back sides of subject wafers, up to 300mm in diameter.
The winner was chosen by a prestigious panel of judges representing a broad spectrum of the microelectronics industry.
Check out all 3 finalists here.
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