TSV moves to “real engineering,” but reliability data needed

July 11, 2011 — Jan Vardaman, president and founder of TechSearch International, summarizes highlights from her SEMICON West presentation on through silicon vias (TSV) (Tuesday, July 12, 2:00-4:30PM,  Heterogeneous Integration session). "We’re finally moving from PowerPoint engineering to real engineering [with respect to TSVs,]" said Vardaman, though progress is slow and will require patience. Wafer bond/debond and wafer thinning/wafer handling are gaining the most attention, she says. And supply chain logistics responsibilities (foundries vs. outsourced semiconductor assembly and test [OSAT]) need to be worked out. Metrology tools are needed to better investigate processes and reliability and it would be nice to see more data. For more on the topic of metrology, SEMATECH is holding a session on 3D metrology at the Marriott Marquis, San Francisco, July 13, at noon. While Vardaman would like to hear more about reliability, especially at the board level, she doesn


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