August 9, 2011 – Amkor has extended its Quad Flat No-Lead (QFN) package design kit to be the first such kit available for Agilent Technologies’ Advanced Design System (ADS) electronic design automation software.

Based on Amkor’s MicroLeadFrame (MLF) packages, the package design kit enables mutual Amkor and Agilent customers to significantly improve their RFIC/MMIC design quality and time-to-market. Designers can quickly explore various design specifications with accurate package information and implement optimized RFIC/MMIC designs, providing a greater range of choices and more flexibility when designing QFN packages.

The Amkor package design kit contains models for 3×3, 4×4, 5×5, and 6×6 MLF QFNs. All die are scalable, and their material properties can easily be modified. The Amkor package design kit also includes scalable models for bond pad arrays and board via arrays. The Amkor package design kit was developed for use with ADS 2009 Update 1 and ADS 2011.01.

"Our customers are looking for easy ways to accurately characterize vendor-supplied packages, both alone and with ICs and laminates mounted," said Todd Cutler, planning and marketing senior manager with Agilent’s EEsof EDA organization, in a statement.

"As Agilent is the RF and microwave CAD leader and many of our customers already use ADS for circuit design and characterization, we are excited to offer this first ever package design kit to our mutual customers," added ChoonHeung Lee, Amkor Technology Korea’s corporate VP and CTO.

Customers can request the QFN Package Design Kit from the Amkor website.