BYD CMOS image sensors fabbed at Dongbu HiTek

August 1, 2011 — Dongbu HiTek began volume production of high dynamic range (HDR) CMOS image sensor (CIS) chips for BYD Microelectronics, a subsidiary of BYD Company Limited, a leading Chinese manufacturer of diverse products (rechargeable batteries to electric automobiles). BYD’s CMOS image sensors will be used for security surveillance applications, with the potential to serve other markets.

Specifying a broad dynamic luminance range between brightest and darkest areas, BYD’s image sensors accurately sample and process intensity levels from direct sunlight to dim moonlight.

Dongbu HiTek’s foundry has been offering specialized CMOS image sensor manufacturing to fabless companies since 2009, including HDR and advanced BCDMOS chips. BYD’s CIS chips will be processed at the 130nm node.

Dongbu HiTek will soon be expanding its common image processing portfolio for VGA and 1.3-to-3.0 Megapixel chips with a 5.0 Megapixel entry.

BYD Microelectronics, a fables subsidiary of BYD Company Ltd., develops ICs and power devices. For more information, visit

Dongbu HiTek Co., Ltd., is a specialty foundry offering analog and mixed-signal processing technologies. Dongbu HiTek publicly trades its stock under 000990 on the Korea Stock Exchange. For more information, visit

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