August 11, 2011 – At SEMICON West 2011, Henkel announced a silver sintering material that requires no pressure. The technology enables high-volume production of modem power packages. "Without having to do the pressure and heat process, you can change your units per hour from 30 up to 6000," said Doug Dixon, global marketing communications director at Henkel, in a video interview at the conference. The company has designed this new process into its Ablestik SSP2000, a high-reliability die attach material well-suited for use with power modules such as IGBTs and high power LED products.

Also at SEMICON West, Henkel announced jointly with STMicroelectonics, that the performance of Henkel’s conductive die attach films (Ablestik C100) was validated for production of very small package configurations in a process called ScalPack, which incorporates die with extremely small dimensions. The company commercialized these materials in early 2011.

The new process eliminates the die fillet, and as such, it enables greater design latitude and process capability, noted Dixon in the video interview. A lower bond line thickness is the result and without the fillet, "the die can be the exact same size as the die pad, so the design capabilities are limitless," said Dixon.