Package-on-package (PoP) track at SMTAI

August 24, 2011 — The SMTA will host sessions and courses with Amkor, Research in Motion, and TechLead Corporation on package-on-package (PoP) 3D stacking at SMTA International (SMTAI), October 16-20 in Fort Worth, TX.

Lee Smith, Amkor Technology, will present "Package on Package (PoP): Past, Present and Future" during the opening session on October 18. Assemblers have integrated PoP surface mount stacking increasingly over the last 5 years, notes Smith. Smartphones and tablet computers rely on PoP for signal processing and memory architectures. Over 11 million packages are surface-mount-stacked each week, he adds. The session is open to all attendees.

Also plan to attend "Assembly Solutions for Next-generation Package on Package (PoP) Requirements and Process" and "Reliability Characterization of PoP Materials and SMT Processes," chaired by Lee Smith of Amkor Technology and "Process and Reliability Characterization of PoP Materials and SMT Processes," chaired by Sheldon Schwandt of Research In Motion.

"Assembly Solutions for Next Generation Package on Package (PoP) Requirements and Process" and "Reliability Characterization of PoP Materials and SMT Processes" will feature Intel Corporation, Qualcomm, and Rambus Inc. speakers.

"Process and Reliability Characterization of PoP Materials and SMT Processes" speakeres include Amkor Technology, Flextronics, and Universal Instruments Corporation.

Charles Bauer, Ph.D., TechLead Corporation, will instruct a half-day tutorial, "3D Assembly…CSP to PoP to Board," covering fundamental to advanced technologies for stacked chip packaging and assembly, as well as stackable packages. Topics include the challenges of die thinning and thin die attach, mixed technology die attachment and bonding, flip chip, multi-level wire bonding, TAB and TSV technologies.  

Details about SMTA International can be found online at http://smta.org/smtai.

The SMTA membership is an international network of professionals in microsystems, emerging technologies, and related electronic assembly business operations.

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