Stanford adds 3 dry etch systems from Plasma-Therm

August 16, 2011 — Stanford University will install 3 Plasma-Therm dry etch systems (based on its VERSALINE technology suite) in its research facility for nanotechnology and photonics, joining 2 Plasma-Therm deposition systems the university requisitioned during a facility upgrade in February 2010.

The 3 new inductively coupled plasma (ICP) etchers will etch advanced silicon, metal, dielectric, and other materialsin Stanford’s Nanofabrication Facility (SNF). The VERSALINE suite targets deep silicon etch (DSE) for silicon on insulator (SOI) structures, among other projects.

Over 600 users have access to the SNF, performing R&D and production-level tasks. It serves academic, industrial and governmental researchers across the US, focusing on optics, MEMS, biology, and chemistry, as well as traditional electronics device fabrication and process characterization. The SNF is a 10,000sq.ft. class-100 cleanroom. It is part of the NSF’s National Nanotechnology Infrastructure Network (NNIN).

Plasma-Therm manufactures advanced plasma processing equipment for specialty semiconductor markets including R&D, solid state lighting, data storage, renewable energy, MEMS, nanotechnology and compound semiconductor. Learn more at

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