September 7, 2011 – 3M and IBM say they are jointly developing a new class of material adhesives specifically for stacking and packaging semiconductors in layers of up to 100 separate chips. The resulting silicon "brick" could make chips 1000
September 7, 2011 – 3M and IBM say they are jointly developing a new class of material adhesives specifically for stacking and packaging semiconductors in layers of up to 100 separate chips. The resulting silicon "brick" could make chips 1000
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