September 23, 2011 — Research and Markets released "Wafer Packaging Fab Database," providing a global overview over 150 companies’ 250+ mid-end semiconductor packaging houses. Small R&D and prototype lines are also listed. Data includes wafer-level packaging (WLP) activity and installed capacities.

Flip chip wafer bumping and wafer-level chipscale packaging (WLCSP) make up the mainstream of WLP. On the leading edge are through silicon via (TSV) for 3D WLP, 2.5D interposers, fan-out WLP (FOWLP) and other technologies that require new capacities and capabilities.   

The database references more than 250 fab locations worldwide with technical information on wafer bumping, re-distributed layers (RDL), passivation, through-silicon via (TSV), and "mid-end" capabilities, and wafer-level packaing capabilities in general.

The database targets equipment & material suppliers looking for customer opportunities, fabless/fab-lite semiconductor companies looking to outsource, and other users.

WLP technologies distribution can be sorted by players, technology type, country, business model, investment & growth evaluation. Users can view the companies performing a certain packaging technology, and study players manufacturing/outsourcing strategy and supply chain. Others can identify and source new WLP service suppliers for their wafer-scale packaging needs. 20+ graphs are included to illustrate global trends.

For more information, visit
http://www.researchandmarkets.com/product/5def06/wafer_packaging_fab_database

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