October 19, 2011 – Marketwire — Semiconductor fab tool maker Mattson Technology Inc. (NASDAQ: MTSN) won acceptance for its Helios XP rapid thermal processing (RTP) system for process of record from a major Asian foundry.
The foundry performed an extensive evaluation of the system, and is now using it in volume production of advanced semiconductors. This is MTSN’s first sale of the Helios XP to a major foundry.
The Helios XP uses Hotshield differential energy control (DEC) technology to minimize pattern loading effects on smaller geometries, larger die-sizes, and more complex intra-dies structures at sub-4X nanometer nodes, noted Andreas Toennis, senior vice president and general manager of Mattson Technology’s Thermal Products Group.
Mattson Technology Inc. designs, manufactures and markets semiconductor wafer processing equipment used in the fabrication of integrated circuits. MTSN operates in three primary product sectors: Dry Strip, Rapid Thermal Processing and Etch. Internet: www.mattson.com.