FSI ORION single-wafer clean tool ordered for Asian foundry

October 3, 2011 — FSI International Inc. (Nasdaq:FSII), surface conditioning equipment supplier, will ship an ORION single wafer cleaning system to a leading Asian semiconductor foundry. The chip maker qualified the ORION for 28nm front-end-of-line (FEOL) wafer processing, using it for all-wet photoresist stripping applications using the high-temperature ViPR process.

FSI expects to recognize revenue for the order in Q1 of fiscal 2012.

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