IMAPS 2011 preview

October 3, 2011 — IMAPS 2011, the 44th International Symposium on Microelectronics, will take place October 9-13 at the Long Beach Convention Center in Long Beach, CA. Ahead of the show, here are some of the highlights for attendees.

Take in the exhibits. Exhibit hall passes are free to all IMAPS 2011 attendees. This includes the exhibitor booths and welcome reception, as well as the keynote presentations and the Global Business Council Marketing Forum. Keynotes will be presented by Liam Madden, corporate VP, Xilinx Inc. and Dr. Ning-Cheng Lee, VP, technology, Indium Corporation.

New professional development courses this year cover counterfeit electronics, advanced packaging, and how to design and analyze an experiment.

The nearly 200 papers at IMAPS 2011 will be divided into 6 tracks:

  • 3D Packaging
  • Modeling/Reliability
  • Next Gen. Materials
  • Assembly & Packaging
  • Advanced Technologies
  • Focus Track: Adv. Packaging & System-Integration.

This year, the GBC forum is titled "Tomorrow’s Supply Chain: Overcoming Environmental & Societal Challenges." In the forum, IBM will look at how packaging is changing the data center, Medtronic will look at the impact of rework, and Hewlett-Packard (HP) will examine the electronics industry’s social and environmental roles.

Learn more before the show by visiting

IMAPS 2011 news:

Palomar Technologies to discuss pulsed heat eutectic solder and chain wire bonding for HB-LEDs

ALLVIA to present latest data for silicon interposers and embedded capacitors


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