Rudolph wins TSV inspection systems order

October 3, 2011 – BUSINESS WIRE — Rudolph Technologies Inc. (NASDAQ:RTEC), semiconductor and related process characterization equipment supplier, shipped its Wafer Scanner 3880 3D Inspection System, multiple NSX Macro Defect Inspection Systems and its Discover Yield Management Software Suite to a leading semiconductor manufacturer for use in developing through silicon via (TSV) structures in advanced 3D ICs. Rudolph cites system speed, accuracy, and flexibility in the multiple-tool win.

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