October 11, 2011 – PRNewswire — MEMS supplier STMicroelectronics (NYSE:STM) has implemented through-silicon vias (TSV) in high-volume micro electro mechanical system (MEMS) devices. ST is using TSV in its smart sensors and multi-axis inertial modules.
The leading-edge packaging technology creates short vertical interconnects instead of wire bonds in ST’s multi-chip MEMS devices.
ST’s Benedetto Vigna, corporate VP and GM of ST’s Analog, MEMS and Sensor Group, reports that its high-volume MEMS packages using TSV are smaller, suiting the needs of consumer products integrating MEMS, such as smartphones.
STMicroelectronics has been producing high-volume MEMS devices for the consumer electronics sector for 5 years. More than 1.6 billion ST MEMS chips has been sold to date.
Also read: MEMS motion sensors’ continuing evolution in commercial markets by Jalinous (Jay) Esfandyari, STMicroelectronics, in association with MEMS Industry Group (MIG)
STMicroelectronics supplies semiconductors for multimedia convergence and power applications. Further information on ST can be found at www.st.com.