SUSS MicroTec wins thin-wafer temporary bonder order

October 18, 2011 — Semiconductor equipment supplier SUSS MicroTec, in partnership with temporary bonding adhesive maker TMAT, will deliver SUSS MicroTec’s new-generation high-volume temporary wafer bond tool clusters to a leading IDM.

The integrated device manufacturer (IDM) will temporarily bond thinned 300mm wafers to carrier wafers for 3D packaging processes. The company makes logic and memory devices. Installation will take place in Q4 2011.

Also read: Thin wafers win majority in electronics by 2016

TMAT adhesive materials and the TMAT process for temporary bonding will be implemented on the SUSS cluster. TMAT and SUSS MicroTec collaborated to tweak the tools and materials to enable the customer’s wafer and process requirements over several months. High throughput was a main purchasing factor for the IDM.

SUSS MicroTec Group is a supplier of equipment and process solutions for microstructuring applications, including back-end packaging. Learn more at www.suss.com.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.