Amkor transitions PBGA packaging to pin-gate molding

November 4, 2011 — Amkor Technology, Inc. (Nasdaq:AMKR) will convert all of its 19mm through 31mm body size plastic ball grid array (PBGA) packages to pin-gate molding (PGM) over the next few years. 

Amkor cites better quality, reliability, and performance, and potentially lower cost than traditional corner gate molding. The transition to pin-gate molding for PBGAs will also extend the use of wire-bonding for smaller silicon nodes, said Pat O

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.