Fujikura, FlipChip International improve embedded die packages

November 11, 2011 — Fujikura Ltd. and FlipChip International LLC (FCI) released ChipletT and ChipsetT embedded die packages for single die or multi-die semiconductor packaging applications.

ChipletT and ChipsetT package products are based on Fujikura’s flex-based laminate embedded die "WABE Technology." The roll-to-roll (R2R) flex fabrication process reportedly reduces costs and package profile (<250

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