MOSAID taps Winpac to package fastest NAND Flash device

November 2, 2011 – Marketwire — MOSAID Technologies Inc. (TSX:MSD) launched the 256Gb HLNAND2 (HyperLink NAND) semiconductor memory device, operating at up to 800MB/s per channel for mass storage applications.

The HLNAND2 Flash memory device is a multi-chip package (MCP) with a nine die stack: eight industry-standard NAND Flash dies, and one MOSAID proprietary ASIC interface chip. The MCP is packaged in a 100-ball ball grid array (BGA) measuring 18 x 14mm.

Winpac, a semiconductor packaging and test house specializing in fine-pitch BGA and wafer-level packaging (WLP), will package and distribute HLNAND devices for MOSAID. The companies signed a 5-year manufacturing license covering the 256Gb HLNAND2 (DDR533/DDR667/DDR800) and the production-ready 256Gb HLNAND (DDR266). Winpac mantains a manufacturing facility in Gyeonggi-do, Korea, and a sales and marketing operation in San Jose, CA.

MOSAID’s HLNAND Flash Memory Specification 2 has a high-speed, point-to-point ring topology, eliminating "power-hungry on-die terminations," said MOSAID’s Jin-Ki Kim, VP of R&D. SSDs using the memory can achieve data transfer rates into the multiple Gigabyte-per-second range. With a raw data rate of up to 800MB/s per channel, and 1600MB/s per channel with DuplexRW, HLNAND2 requires only one memory channel to reach a data transfer rate on the host interface exceeding 1 GB/s. The point-to-point interface creates a clean signaling environment with reduced loading, added Kim. Product features and specs are available at

MOSAID is showcasing its HLNAND technology, and presenting a related paper, at Operating System Support for Next Generation Large Scale Non-Volatile Random Access Memory (NVRAMOS11) in Jeju, Korea, November 7-10, 2011.

MOSAID Technologies Inc. is a leading intellectual property company in the areas of semiconductors and communications, and develops semiconductor memory technology. For more information, please visit
Winpac is a semiconductor packaging and device testing company. For more information please visit

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