SEMATECH creates 3D packaging standards development forum

November 7, 2011 — SEMATECH has created an online 3D Standards Dashboard, allowing 3D semiconductor and MEMS interconnect professionals to exchange standards activity information. This Dashboard, managed by SEMATECH’s 3D Enablement Center, will help develop standards in the 3D packaging field with the help of IEEE Standards Association, JEDEC, SEMI, and Si2.

3D heterogenous integration lacks uniform standards for key manufacturing parameters, which are neccessary for an orderly supply chain and high-volume production. Because standards are needed in many areas and over broad technology bases, the Dashboard is designed to improve information sharing, which will accelerate standard development and adoption, and avoid duplication of effort.

Companies involved in 3D production can use the 3D Standards Dashboard to find existing standards as well as to identify and track standards development activities in areas such as design, testing and production. Additionally, the 3D Standards Dashboard provides a proactive forum for facilitating collaborative discussions on perceived gaps in standardization activities and for identifying which standards development organizations (SDO) will best meet the need for a specific standardization activity.

SEMATECH, IEEE, JEDEC, SEMI, and Si2 invite fabless, fab-lite and IDM companies, outsourced semiconductor assembly and test (OSAT) suppliers, and EDA process tool and materials suppliers worldwide to participate by visiting http://wiki.sematech.org/3D-Standards.

Example of 3D packaging standards collaborations:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.