Wireless chip maker adds Plasma-Therm etch/depo tool

November 9, 2011 — Plasma-Therm LLC, plasma process equipment supplier, sold a multi-chamber VERSALINE etch and deposition system to a leading North American wireless compound semiconductor manufacturer. The customer has Plasma-Therm VERSALINE and Versalock equipment at this site already.

An inductively coupled plasma (ICP) etch module adds capacity for advanced back-side gallium arsenide (GaAs) via formation. A plasma-enhanced chemical vapor deposition (PECVD) module provides low-damage, low-stress precision silicon nitride deposition for capacitor fab and passivation steps. Each process chamber includes Plasma-Therm


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