December 30, 2011 — As the semiconductor industry moves into the 22nm silicon technology node, device fabrication is not the only challenge that the industry will face. According to the International Technology Roadmap for Semiconductors (ITRS), a porous ultra-low-k (ULK) material will replace the traditional silicon dioxide. Stresses within the die must be controlled, not only during wafer fabrication, but also in packaging and assembly.

This will be even more challenging than the industry