2.5D announcements at the Global Interposer Tech conference

December 6, 2011 – Practitioners, students and other interested parties assembled in Atlanta at the recent Global Interposer Technology workshop (GIT) on the Georgia Tech campus to discuss where the technology stands and where it is going.

Xilinx, the first to reach HVM with their Vitrex-7 2000T FPGA, detailed various aspects of their 2.5D interposer product. Suresh Ramalingam, senior director of advanced package design, announced that their Virtex product, which uses a 21mm

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