December 5, 2011 — Applied Materials Inc. debuted its defect review scanning electron microscope (DR-SEM) Applied SEMVision G5 system to image and analyze 20nm yield-limiting defects in a semiconductor production environment without manual intervention. Identifying and imaging relevant defects with 1nm pixel size, the SEMVision G5 system allows logic and memory makers to pinpoint the root cause of defects faster and more accurately, Applied reports.
The SEMVision G5 system is capable of identifying, analyzing and finding defects in challenging patterning layers with increased throughput. AMAT reports that it is highly accurate in separating real from false alarm "nuisance defects," beating a human operator in comparisons.
The SEMVision G5 system is an open architecture platform that dynamically combines data received from a wafer inspection system with a library of predefined review strategies. The system automatically creates new review recipes, targeting foundry users with thousands of new chip designs to manufacture each year.
"We’ve already shipped multiple SEMVision G5 systems to customers, including repeat orders," said Itai Rosenfeld, corporate vice president and general manager of Applied’s Process Diagnostics and Control business unit.
Applied Materials will exhibit at SEMICON Japan, December 7-9 in Chiba, Japan at Booth 3D-1001.
More SEMICON Japan products:
- Innolas makes 450mm wafer handling system
- Dainippon Screen develops maskless direct imaging exposure system
- Dainippon Screen single-wafer clean tool boasts 800 WPH
- ULVAC CVD-Co, -Ni system suits 3D gate, MEMS fab
Applied Materials, Inc. (Nasdaq:AMAT) provides equipment, services and software to enable the manufacture of advanced semiconductor, flat panel display and solar photovoltaic products. Learn more at www.appliedmaterials.com.