Amkor PoP tech surpasses 100M units

December 24, 2011 — Amkor Technology Inc. (Nasdaq:AMKR), semiconductor assembly and test services (SATS) provider, has shipped more than 100 million units of its Through Mold Via (TMV) package-on-package (PoP) products.

The technology launched about a year ago, tapping into the mobile electronics demand — smartphones, tablets — for vertical CPU and memory stacking, said Mike Lamble, Amkor


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