ASM brings Fraunhofer into ALD and CVD process dev

December 9, 2011 — Fraunhofer CNT and semiconductor fab equipment supplier ASM International NV will collaborate under a Joint Development Agreement on various new projects over the next 5 years, including CVD and ALD process development.

Fraunhofer CNT and ASM will develop new processes and integration methods, starting on ASM’s Advance series A412 300mm vertical batch furnace configured for atomic layer deposition (ALD) and low pressure chemical vapor deposition (LPCVD).  Fraunhofer CNT will provide space and infrastructure for the A412 system in its clean room.  In the first project, the objective is to develop and integrate novel batch ALD processes and materials for use in CMOS logic technology.  

In addition to 40 clean room tools, scientists at Fraunhofer CNT offer considerable expertise in process and materials characterization as well as the characterization of nano-electronic devices. Pre-processed test or product wafers provided by ASM or its customers will be processed at Fraunhofer CNT under strict cross contamination requirements as developed through several years in cooperation with leading edge IC manufacturers. Thus, the results can be transferred immediately into production. This enables our partners to reduce their capital expenditures and accelerate their developments.

Ivo Raaijmakers, CTo, ASM, noted that the company has collaborated with Fraunhofer CNT for more than 5 years, with success.

Fraunhofer CNT provides collaboration opportunities for research institutes and material/equipment manufacturers in the field of micro- and nanoelectronics. Within the premises of Infineon there is a clean room area (clean room class 1000) of about 800 m


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