Copper wire bonding offered from Quik-Pak

December 16, 2011 — Microelectronics packaging and assembly provider Quik-Pak, a division of Delphon Industries, is performing copper wire bonding on a Kulicke & Soffa (K&S) Maxum Ultra wire bonder. Available wires include bare copper and palladium-coated copper.

Quik-Pak’s copper ball bonding can be done with 20

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