December 23, 2011 – BUSINESS WIRE — SEMATECH, a global consortium of chip manufacturers, partnered with equipment maker Dainippon Screen Mfg. Co. Ltd. (Screen) to accelerate development and commercialization of advanced semiconductor doping technology.
SEMATECH and Screen will focus on monolayer doping and activation methods compatible with ultra-shallow junctions for planar and non-planar device technologies (e.g., FinFETs, nanowires, memories) in silicon and non-silicon high-mobility materials. Their aim is to support the ITRS roadmap and develop monolayer doping for commercial device fabrication.
Ultra-shallow, abrupt, damage-free junctions with high active dopant concentrations are essential for better off-state leakage control, resulting in faster transistors. Doping conformality and minimal lattice damage are increasingly important for non-planar device architectures and high-mobility compound semiconductors.
"This alliance could be a key driver for improving annealing processes," said Tadahiro Suhara, president of the Semiconductor Equipment Company at Screen. Dan Armbrust, president and CEO of SEMATECH, added that the partnership helps SEMATECH develop "critical infrastructure" for a major semiconductor industry transition to non-planar and non-silicon high-mobility channels.
Dainippon Screen provides flat panel display and semiconductor manufacturing equipment. For more information, please visit http://www.screen.co.jp.
SEMATECH is an international consortium of leading semiconductor manufacturers. Internet: www.sematech.org.