December 5, 2011 – BUSINESS WIRE — USHIO Inc. is introducing three models of its UX4 Series of modular full-field projection lithography tools. One is the UX4-MEMS FFPL 200 with the overlay accuracy of 0.5µm for manufacturing micro electro mechanical system (MEMS) devices, mounted with the newly developed lens module having a maximum depth of focus of 500µm and the auto mask changer module for manufacturing multiple device types.
The other systems are the UX4-ECO FFPL 150 for manufacturing power devices compatible with mirror projection mask aligner (MPA) masks and the UX4-3Di FFPL 300 mounted with a full-field projection lens of 300mm in diameter for manufacturing 3D LSI devices on 300mm wafers.
UX4-MEMS FFPL 200 is a 200mm-wafer, full-field projection lithography tool for manufacturing MEMS devices. The lithography tool can be customized and optimized for each MEMS device type via a flexible combination of high-performance modules. Alignment accuracy is 0.5µm or less. These modules include a newly developed lens module with a maximum depth of focus of 500µm, a 30-stage auto mask changer, and a specially designed wafer transfer module that can handle warped wafers and special substrates. The double-alignment camera (DC) system enables simultaneous projection of the top- and backside of a wafer for high-precision machining from both sides. The tool is available this month.
UX4-ECO FFPL 150 is a 150mm-wafer, MPA-mask-compatible, full-field projection lithography tool for manufacturing power devices. It uses a high-performance 150mm-diameter lens for resolution of L/S = 2/2µm. This updates the lithography tool without changing the existing manufacturing process and enhances the throughput of full-field projection. The tool will be available in June 2012.
UX4-3Di FFPL 300 is a 300mm wafer, full-field projection lithography tool for manufacturing 3D LSI devices. USHIO achieved throughput of 120 300mm wafers per hour, as well as up to 50% of reduction in CoO by mounting the new 300mm full-field projection lens on the same platform as the UX4-3Di FFPL 200, released this September. Learn more.
USHIO will complete development and start marketing these models one-by-one within the next six months.
These three models will be exhibited and detailed through a panel display as well as a stage presentation at USHIO booth No. 5A-606 (Hall 5) during SEMICON Japan 2011, December 7-9 at Makuhari Messe in Chiba, Japan.
More debuts at SEMICON Japan:
- EVG doubles process module space in XT Frame platform
- Crossing Automation FOUP buffer improves wafer movement and storage
- Innolas wins 450mm wafer handling order
- Dainippon Screen develops maskless direct imaging exposure system
- Dainippon Screen single-wafer clean tool boasts 800 WPH
- ULVAC CVD-Co, -Ni system suits 3D gate, MEMS fab
- AMAT BSI image sensor CVD tool operates at low processing temps
- AMAT debuts SEM for automatic 20nm defect inspection
USHIO INC. handles a variety of light sources for a broad range of industrial applications. USHIO also manufactures and markets products incorporating its own light sources, such as optical systems for manufacturing FPDs and other electronics components and devices as well as imaging equipment. Visit http://www.ushio.co.jp/en/.