January 19, 2012 – BUSINESS WIRE — Hitachi Chemical Co. Ltd. (TOKYO:4217) filed a lawsuit against INNOX Corporation with the Intellectual Property Court of Taiwan, alleging infringement on Hitachi Chemical’s Taiwanese patent related to die bonding film used in semiconductor packaging processes.

Hitachi Chemical’s Taiwan Patent No. I298084 is the subject of the company’s patent case, alleging use in INNOX’s product WL-0020-05A, a die bonding film for wafer dicing steps. Hitachi Chemical has sent INNOX a warning letter concerning patent infringement based on Korean patent and further negotiated with INNOX in April 2011 without an amicable settlement. Hitachi Chemical has now filed a lawsuit against INNOX’s WL-0020 series products in Taiwan.

Hitachi Chemical developed a die bonding film in 1993, used for multi-laminate semiconductor attach, bonding semiconductor chips often in high density, multi-layer package designs. Hitachi Chemical offers die bonding film, dicing die bonding film and related products, and claims the largest global market share. The company has about 500 patents (including pending applications) related to die bonding films and dicing die bonding films in Japan and other countries.

Contact Hitachi Chemical Co., Ltd. (Japan) at http://www.hitachi-chem.co.jp/english/index.html.

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