PTI buys NEXX deposition tool for RDL and Cu pillar fab

January 3, 2012 – PRNewswire — Packaging equipment provider NEXX Systems sold a 300mm Stratus electrochemical deposition (ECD) system to Powertech Technology (PTI), a major IC packaging and testing company in Taiwan. PTI will use the Stratus to make copper pillar bumps and re-distribution layers (RDL) for portable intelligent device packages, targeting smart phone and tablet PC applications.

The tool will be evaluated for PTI’s through silicon via (TSV) commercialization program.  

Also read: Nantong Fujitsu Microelectronics installs NEXX tool for copper pillar, RDL packaging

PTI is primarily known for memory device assembly, in high volumes, supplying integrated device manufacturers (IDMs) and fabless companies, said Scott Jewler, Senior General Manager, PTI. Jewler expects that the new deposition tool will help PTI lower the cost of leading-edge packaging.

NEXX Systems offers electrochemical deposition and physical vapor deposition systems for advanced semiconductor packaging. Learn more at

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