January 10, 2012 — The SMTA released its call for presenters for SMTA International (SMTAI) 2012, October 14-18 in Orlando, FL. The association, along with Chip Scale Review magazine, also announced the keynote for the International Wafer-level Packaging Conference (IWLPC), held November 5-8, San Jose, CA.
SMTAI papers are sought on electronics assembly as well as advanced packaging and components. Packaging papers can cover 0.3mm Pitch Area Array, 3D Packaging and Integration, BGA/CSP, Biomedical Packaging, Bumping, Chip on Board, Direct Chip Attach, Embedded and Miniature Passives, Failure Analysis, Fine Lead Pitch, Flip Chip, High Temperature Packaging, Lead Finishes, Leadless Packages (LGA/QFN/BTC), MEMS and Sensors, Package on Package (PoP), Photonics, Photovoltaics and Solar Packaging, Reliability, Solid and Collapsible Wafer Bumps, Through Silicon Vias (TSVs), Tin Whiskers, and Wafer Level Packaging (WLP). See SMTA’s Call for Papers site to check out all the suggested topics for emerging technologies, electronics assembly, supply chain/business papers, PCB technology, process control, and energy papers.
SMTA International offers Best of Conference Presentation, Best of Proceedings Paper, and Best International Paper awards at the show.
Abstracts (300 words) are due March 12, 2012, and can be submitted here: http://www.smta.org/smtai/call_for_papers.cfm. All abstracts must be submitted online and will not be accepted by e-mail.
Proposals are also solicited from individuals interested in teaching educational courses related to surface mount technology, advanced packaging, and electronics manufacturing.
Paper manuscripts and course workbooks are due by July 27, 2012. Papers should be 6-15 pages long (including graphics) and describe significant results from experiments, emphasize new techniques, or contain technical, economic, or appropriate test data. Presentation materials and papers must be original, unpublished, and non-commercial in nature.
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John Ellis will keynote IWLPC, discussing Cyber-Physical Terrorism in his presentation, "A Trojan Chip in Your Smartphone? It’s Coming…"
The topic is malicious circuits receiving commands via social networks. Hacking a few highly-followed celebrity accounts would provide a perfect avenue for distributing ‘self-destruct’ codes to millions of Trojan chips. A widespread, cyber-physical attack, which would have been almost impossible to pull off just a few years ago, could soon become reality.
After graduating from the University of Texas with a Master’s in Mechanical Engineering, John worked at Sandia National Labs, where he focused on R&D projects for the Department of Energy, Department of Defense, National Institute of Standards and Technology, and other federal agencies. His experience includes nuclear weapons testing, missile guidance (Advanced Cruise Missile), air-borne and space-borne imaging systems (Predator UAV), and semiconductor manufacturing. John