Zymet PoP underfill offers lower viscosity, CTE for finer pitches

January 11, 2012 — Zymet introduced the CN-1736 reworkable underfill encapsulant for 0.4mm-pitch package-on-package (PoP) assemblies.

Figure. Void-free underfill of 0.4-mm pitch POP with CN-1736.

The underfill boasts low viscosity and a lower CTE than its predecessors, and greater flux compatibility. The 650cps viscosity enables optimized flow speed with finer pitch devices. The CTE of 55 ppm/

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