IBM, Samsung, GLOBALFOUNDRIES, ARM to keynote Common Platform Technology Forum

February 23, 2012 — Simon Segars, president of ARM Inc., will keynote the Common Platform Technology Forum, along with senior technology executives from IBM, Samsung and GLOBALFOUNDRIES, March 14 (Pi Day) in Santa Clara, CA.

The 2012 conference will highlight the Common Platform’s advanced R&D pipeline to address technology challenges and customer demands for future consumer electronics. These presenters are "at the forefront of innovation," said Dr. KH Kim, executive vice president for Samsung Electronics’ Foundry business, on behalf of the Common Platform alliance, noting the importance of "the next wave of consumer and mobile products" coming from today’s semiconductor R&D.

Morning general session speakers:

  • Dr. Gary Patton, Vice President of IBM Semiconductor R&D
  • Gregg Bartlett, Chief Technology Officer for GLOBALFOUNDRIES
  • Dr. Jong Shik Yoon, Senior Vice President of Samsung Electronics’ Semiconductor R&D 
  • Simon Segars, President, ARM Inc. and Executive Vice President and General Manager of Physical IP division, ARM Ltd.

At the 2011 Common Platform Technology Forum, Dr. Patton announced that the Platform would be moving to a gate-last high-k metal-gate (HKMG) technology at the 20nm node. Read: Common Platform Goes Gate-Last — at Last! from blogger Dick James, Chipworks.

The afternoon will host in-depth technical sessions from members of the Common Platform partners’ technical teams and ecosystem industry leaders. The forum will focus on collaboration for technology delivery, highlighting the rich and broad ecosystem of design enablement and implementation partners through a Partner Pavilion featuring leading EDA, IP, library, lithography mask, semiconductor packaging, and design services companies.

Register for the complementary, one-day event at

The Common Platform companies represent the world’s largest chip-making consortium. IBM, Samsung, GLOBALFOUNDRIES and more than 20 additional companies form the Common Platform alliance focus on leading-edge, jointly developed digital CMOS process technologies and advanced manufacturing. The Common Platform model is supported by a comprehensive ecosystem of design enablement and implementation partners from the EDA, IP and design services industries. This ecosystem allows foundry customers to source their chip designs to multiple 300mm foundries.

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