Nextreme brings thin-film on-par with bulk thermoelectrics

February 6, 2012 — Micro-scale thermal management device maker Nextreme Thermal Solutions announced that its thin-film thermoelectric technology has achieved a 60.1°C temperature difference between its cold and hot sides at an ambient temperature of 24.7°C, bringing it on par with the performance of bulk thermoelectric technology.

The 60°C temperature milestone, known as the ΔTmax, indicates the thermoelectric device’s ability to pump heat efficiently, improving cooling and lowering input power requirements for applications in electronics, photonics, automotive, avionics, and high-speed PCR applications.

The improved performance is the result of new materials development at Nextreme and the use of advanced, state-of-the-art interconnect and contact technology developed at the Center for Solid State Energetics at RTI International.

Nextreme will be introducing new products with this higher level of cooling performance in 2012.

Nextreme Thermal Solutions manufactures thin-film thermoelectric modules and subsystems. For more information, visit

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