SEMICON China: Challenges and opportunities for semiconductors, emerging techs

February 23, 2012 — SEMICON China takes place March 20-22 in Shanghai, with SOLARCON China and FPD China, together featuring 1,000+ exhibitors, 150+ government delegations, and 50,000+ attendees.

2011 saw 26% growth for semiconductor fab equipment spending in China, according to the most recent SEMI Consensus Forecast. China’s current Five-Year Plan (2011-2015) targets expansion for China’s microelectronics supply chain to meet the needs of the regional and global markets. US$40+ billion will be invested to fuel Chinese semiconductor industry growth during this period.

SEMICON China showcases the latest advanced manufacturing technologies and programs on the latest technology and business trends in the semiconductor industry and emerging markets. Keynote speakers include:

  • Tzu-Yin Chiu, CEO and executive director, SMIC
  • Tien Wu, director and COO, ASE Group
  • Yu Wang, director, president, Hua Hong Semiconductor; president, Grace Semiconductor Manufacturing
  • Charlene Barshefsky, former U.S. Trade representative, senior International partner, WilmerHale
  • Yoichi Yano, executive VP, Renesas Electronics
  • Walden C. Rhines, CEO, Mentor Graphics

This year’s event features four Theme Pavilions, each focused on a growing critical technology market:

  • The China Market IC Applications Pavilion spotlights companies and technologies focused on serving the fabless and IC design community. From IC design services to foundries to system assembly and test, the Pavilion showcases the best of China’s IC supply chain. Pavilion highlights include: Focus on 450mm wafer manufacturing; advanced automotive semiconductors; power ICs; assembly and test; and MEMS design and manufacturing.
  • The LED Manufacturing Pavilion features manufacturing technologies and information specifically focused on advanced LED and solid state lighting. China currently leads the world in terms of the number of active and under construction LED epi wafer and chip fabs. In 2011, over 400 new MOCVDs systems were installed in China, more than any other country in the world.
  • The TSV Pavilion showcases technologies and solutions for 3D IC and TSV systems. The growth of 3D IC and TSV has spawned a whole ecosystem for TSV technologies from industry, academia and research institutions, to equipment and material suppliers. 
  • The Secondary Equipment Applications, Service and Fab Productivity Solutions Pavilion  features exhibits and solutions for the growing secondary equipment market in China. Analysts project sales of used semiconductor equipment China to increase to between US$ 800 million and US$1 billion in 2012.

Prior to SEMICON China, March 18-19, the China Semiconductor Technology International Conference (CSTIC) will offer more than 300 high-level presentations, covering all aspects of semiconductor technology and manufacturing. Keynote speakers include representatives from IMEC, Samsung, and IBM.

SEMICON China also includes LED China Conference 2012 (March 21), addressing current government policies and support for LED manufacturing expansion; new developments in LED applications, LED fab equipment, and materials; and discussion on how the China LED fab industry can continue its growth.

March 20-22 will host a review of China’s High-Tech Parks, which help shape China’s semiconductor and emerging market (photovoltaic, HB-LED, etc.) industries. China’s regional governments overseeing these high-tech parks strongly support and are willing to provide additional resources to develop the semiconductor industry. Leaders from China’s major municipal governments and high-tech parks are invited to introduce their development plans and special policies. This High-Tech Park review area provides an excellent opportunity for companies which plan to expand China operations and market access.

Additional information regarding SEMICON China 2012 exhibition, programs, and registration is available at

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