AMAT, Singapore’s microelectronics institute open 3D semiconductor packaging R&D lab

March 7, 2012 — Semiconductor fab equipment supplier Applied Materials Inc. (AMAT) opened the new Centre of Excellence in Advanced Packaging at Singapore’s Science Park II with its partner in the endeavor, the Institute of Microelectronics (IME), a research institute under Singapore’s Agency for Science, Technology and Research (A*STAR). Singapore’s Minister for Trade and Industry, Lim Hng Kiang, presided at the official opening ceremony.

Plans for the Centre were first announced in April 2011.

The Centre of Excellence in Advanced Packaging will focus on wafer-level and 3D packaging technologies, with a 14,000 square foot Class-10 cleanroom housing 300mm wafer processing equipment. It was created with combined investment of over USD100 million from Applied Materials and IME.

Applied Materials will provide the leading-edge equipment and process technology to be used by IME

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