March 14, 2012 — Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity etch tool for 200mm wafer-level packaging (WLP), micro electro mechanical systems (MEMS), light-emitting diodes (LEDs), CMOS image sensors (CIS), and other 3D IC applications.
The tool boasts a dual-station chamber architecture for faster throughput with single- or dual-wafer processing, integrated pre-heat stations, and a gas delivery design tailored for better uniformity and higher etch rates of through silicon vias (TSVs) in semiconductor die. A de-coupled high-density plasma source and bias increase etch rates at lower pressures and enable process control over a wide process window. This configuration can be extended to accommodate up to three dual-station process modules. An RF pulsing bias capability eliminates profile notching.
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AMEC claims a 30% capital-efficiency premium over other available TSV etchers. The system is flexible to etch a wide range of wafer-level features, said Tom Ni, VP at AMEC, noting a "constantly evolving" product mix at manufacturers.
Several Primo TSV200E tools are deployed for production at Q Technology Limited (Q Tech) and JCAP Corp. (JCAP) in China, supporting advanced packaging of semiconductors. 3D semiconductor packaging is "a key component of our technology roadmap, said JCAP president C.M. Lai. JCAP is meeting its product development milestones using the AMEC process modules for TSVs. JCAP has placed a repeat order, Lai noted.
AMEC expects orders soon from Taiwan and Singapore. AMEC notes that strong demand should come from China-based companies.
Development of a 300mm version is underway.
More data on the tool can be found at http://amec-inc.com/products/TSV.php.