March 20, 2012 — Advanced Micro-Fabrication Equipment Inc. (AMEC) installed a second-generation dielectric etch tool, the Primo AD-RIE, at Chinese foundry SMIC. It is the first time AMEC has installed the Primo AD-RIE in China.
The tool will perform wafer processing at the 32/28nm nodes and below. Also read: Semicon China — SMIC Shows off 28-nm HKMG Development from blogger Dick James, Chipworks
The Primo AD-RIE tool is an Advanced Decoupled Reactive Ion Etch (AD-RIE) system designed to build 22/14nm semiconductor devices. It is based on the Primo D-RIE, with additions such as a frequency-switchable RF system; better tunability techniques for ultra-fine Critical Dimension (CD) uniformity and repeatability; and enhanced chamber materials.
The Primo AD-RIE offers 30% better capital productivity, 30% smaller footprint, and 20-40% better cost of ownership than competitive tools, said Michael Chu, Vice President and General Manager of AMEC’s Etch Product Business Group.
Additional Primo AD-RIE tools are installed at customer sites in Taiwan, and the first-generation of the tool (Primo D-RIE) is established in China. Across China, Taiwan, Singapore, and Korea, AMEC tools are installed in 14 fabs of 11 customers (IDMS, foundries, and packaging houses).
AMEC will soon complete a large expansion of its Shanghai facility, adding more than 10,000 square meters of manufacturing space.
More information on the Primo AD-RIE tool can be found at www.amec-inc.com/products/ADRIE.php.